Highly filled liquid epoxy for smaller, more reliable chip packaging
As computer chips become more powerful and compact, the materials that protect them must perform better than ever. In advanced chip packaging, liquid epoxy is widely used because it can flow into tiny spaces before curing into a solid protective layer. To be effective, the materi
As computer chips become more powerful and compact, the materials that protect them must perform better than ever. In advanced chip packaging, liquid epoxy is widely used because it can flow into tiny spaces before curing into a solid protective layer. To be effective, the materi This story matters for Science & Discovery readers tracking student. Reported by phys.org. Read the full original at the source link below.
Originally reported by phys.org. StudentNews curates and briefs the science & discovery stories that matter. Our editorial policy →